منابع مشابه
RF MEMS Switch Technology
Commercial Applications Solid state and electromagnetic relay switches are being replaced by MEMS switches due to their lower costs and increased application performance. Some of the benefits of MEMS switches include low power consumption, long life cycle, linearity and increased switching speeds. Applications include highspeed digital channel switching in automated test equipment, filter bank ...
متن کاملRf & Microprocessor Circuits for Mems Sensor Packaging
In the resent years wireless Home Automation products like lightning, thermostats blinds/drapes and appliance control, energy management, access control and building automation has reached the market. With the combination of highly integrated RF and micro-processor platform and micro electromechanical systems (MEMS) the wireless sensors and actuators of tomorrow will be ultra cheap and small an...
متن کاملRF-MEMS packaging technique using benzocyclobutene (BCB)
RF-MEMS switches contain movable fragile parts. A specific packaging approach is required for reasons of protection during fabrication as well as during operation. We present in this paper a 0-level packaging process using a photopatternable polymer BenzoCycloButene and its performances measured up to 110 GHz.
متن کاملParasitic Effects Reduction for Wafer-Level Packaging of RF-Mems
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon substrate with throughsubstrate intercon...
متن کاملBCB Based Packaging for Low Actuation Voltage RF MEMS Devices
This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2004
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.7.299